
TEAMGROUP T-Force Vulcan Z CL18 DDR4 16GB (16GBx1) 3600MHz Desktop RAM (Red)
TEAMGROUP T-Force Vulcan Z CL18 DDR4 16GB (16GBx1) 3600MHz Desktop RAM (Red)
Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures.
The DDR4 gaming memory is made and selected through a rigorous testing process for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, stability and compatibility.
Features
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
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TEAMGROUP T-Force Vulcan Z CL18 DDR4 16GB (16GBx1) 3600MHz Desktop RAM (Red)
TEAMGROUP T-Force Vulcan Z CL18 DDR4 16GB (16GBx1) 3600MHz Desktop RAM (Red)
Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures.
The DDR4 gaming memory is made and selected through a rigorous testing process for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, stability and compatibility.
Features
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
Product Information
Product Information
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Shipping & Returns
Description
TEAMGROUP T-Force Vulcan Z CL18 DDR4 16GB (16GBx1) 3600MHz Desktop RAM (Red)
Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures.
The DDR4 gaming memory is made and selected through a rigorous testing process for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, stability and compatibility.
Features
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage












